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Curve sight distance (Horizontal curves for highway design)

Horizontal alignment in road design consists of straight sections of road, known as tangents, connected by circular horizontal curves. Circular curves are ... more

Long Chord Length (Horizontal curves for highway design)

Horizontal alignment in road design consists of straight sections of road, known as tangents, connected by circular horizontal curves. Circular curves are ... more

Curve Length (Horizontal curves for highway design)

Horizontal alignment in road design consists of straight sections of road, known as tangents, connected by circular horizontal curves. Circular curves are ... more

Middle Ordinate (Horizontal curves for highway design)

Horizontal alignment in road design consists of straight sections of road, known as tangents, connected by circular horizontal curves. Circular curves are ... more

External Distance (Horizontal curves for highway design)

Horizontal alignment in road design consists of straight sections of road, known as tangents, connected by circular horizontal curves. Circular curves are ... more

Tangent Length (Horizontal curves for highway design)

Horizontal alignment in road design consists of straight sections of road, known as tangents, connected by circular horizontal curves. Circular curves are ... more

Exhaust Gas Velocity

A rocket engine nozzle is a propelling nozzle (usually of the de Laval type) used in a rocket engine to expand and accelerate the combustion gases produced ... more

Petroff's Law - Torque required to shear the lubricant film (for small radial loads)

In the design of fluid bearings, the Sommerfeld number (S), or bearing characteristic number, is a dimensionless quantity used extensively in hydrodynamic ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

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