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Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Auger electron spectroscopy is a common analytical technique used specifically in the study of surfaces and, more generally, in the area of materials ... more

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

In engineering, deflection is the degree to which a structural element is displaced under a load.
This maximum deflection occurs at a distance x_1 ... more

In hyperbolic geometry, the law of cosines is a pair of theorems relating the sides and angles of triangles on a hyperbolic plane, analogous to the planar ... more

Centripetal force (from Latin centrum “center” and petere “to seek”) is a force that makes a body follow a curved path: its ... more

A lens is a transmissive optical device which affects the focusing of a light beam through refraction. A simple lens consists of a single piece of ... more

Converging lens in air will focus a collimated beam travelling along the lens axis to a spot (known as the focal point) at a distance “f” from ... more

An I-beam, also known as H-beam, W-beam (for “wide flange”), Universal Beam (UB), Rolled Steel Joist (RSJ), or ... more

In engineering, deflection is the degree to which a structural element is displaced under a load. It may refer to an angle or a distance.
The angle of ... more