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Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

A lens is a transmissive optical device which affects the focusing of a light beam through refraction. A simple lens consists of a single piece of ... more

Electric flux is the rate of flow of the electric field through a given area. Electric flux is proportional to the number of electric field lines going ... more

Thrust is a reaction force described quantitatively by Newton’s second and third laws.
The power needed to generate thrust and the force of the ... more

Auger electron spectroscopy is a common analytical technique used specifically in the study of surfaces and, more generally, in the area of materials ... more

In a nozzle or other constriction, the discharge coefficient (also known as coefficient of discharge) is the ratio of the actual discharge to the ... more

In solid mechanics, torsion is the twisting of an object due to an applied torque. The torsion constant is a geometrical property of a bar’s cross-section ... more

In solid mechanics, torsion is the twisting of an object due to an applied torque. The torsion constant is a geometrical property of a bar’s cross-section ... more

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

A bimetallic strip is used to convert a temperature change into mechanical displacement. The strip consists of two strips of different metals which expand ... more