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Modulus of resilience

Resilience is the ability of a material to absorb energy when it is deformed elastically, and release that energy upon unloading. Proof resilience is ... more

Critical Buckling Stress of a Column with Buckling Coefficient

Column or pillar in architecture and structural engineering is a structural element that transmits, through compression, the weight of the structure above ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

Griffith's criterion in Linear elastic fracture mechanics (critical stress intensity factor)

Fracture mechanics is the field of mechanics concerned with the study of the propagation of cracks in materials. It uses methods of analytical solid ... more

Lame's first parameter (in three dimensions)

In linear elasticity, the Lame parameters are the two parameters that constitute a parametrization of the elastic moduli for homogeneous isotopic media. ... more

Lame's first parameter (for two-dimensional solids)

In linear elasticity, the Lame parameters are the two parameters that constitute a parametrization of the elastic moduli for homogeneous isotopic media. ... more

Critical buckling stress of a column

Column or pillar in architecture and structural engineering is a structural element that transmits, through compression, the weight of the structure above ... more

Rotational stiffness ( depended on rigidity modulus of the material)

Stiffness is the rigidity of an object — the extent to which it resists deformation in response to an applied force. In general, stiffness is not the same ... more

Micro chevron (MC) test (critical energy release rate)

The wafer bond characterization is based on different methods and tests. Wafer bonds are commonly characterized by three important encapsulation ... more

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