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Properties of concrete - modulus of elasticity (AASHTO)

The modulus of elasticity of concrete is a function of the modulus of elasticity of the aggregates and the cement matrix and their relative proportions. ... more

Properties of concrete - modulus of elasticity for normal weight concrete

The modulus of elasticity of concrete is a function of the modulus of elasticity of the aggregates and the cement matrix and their relative proportions. ... more

Concrete electrical resistivity (rebars method)

Rebar (short for reinforcing bar), is a steel bar or mesh of steel wires used as a tension device in reinforced concrete and reinforced masonry structures ... more

Electrical resistivity measurement of concrete

Electrical resistivity (also known as resistivity, specific electrical resistance, or volume resistivity) is an intrinsic property that quantifies how ... more

Mohrâ€“Coulomb failure criterion

Mohrâ€“Coulomb theory is a mathematical model describing the response of brittle materials such as concrete, or rubble piles, to shear stress as well as ... more

Sorptivity

In 1957 John Philip introduced the term sorptivity and defined it as a measure of the capacity of the medium to absorb or desorb liquid by capillarity.
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Griffith's criterion in Linear elastic fracture mechanics (stress intensity factor)

Fracture mechanics is the field of mechanics concerned with the study of the propagation of cracks in materials. It uses methods of analytical solid ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

Micro chevron (MC) test (critical energy release rate)

The wafer bond characterization is based on different methods and tests. Wafer bonds are commonly characterized by three important encapsulation ... more

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