Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more
In engineering, deflection is the degree to which a structural element is displaced under a load.
The elastic deflection of a weightless cantilever ... more
In engineering, deflection is the degree to which a structural element is displaced under a load. It may refer to an angle or a distance.
The angle of ... more
A cantilever is a beam anchored at only one end. The beam carries the load to the support where it is forced against by a moment and shear stress. A ... more
The Sears–Haack body is the shape with the lowest theoretical wave drag in supersonic flow, for a given body length and given volume. The mathematical ... more
NPSH characterize the potential for cavitation. The suction head coefficient is a dimensionless measure of ... more
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