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Hooke’s law is a principle of physics that states that the force F needed to extend or compress a spring by some distance X is proportional to that ... more
The wafer bond characterization is based on different methods and tests. Wafer bonds are commonly characterized by three important encapsulation ... more
Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more
Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more
Fracture mechanics is the field of mechanics concerned with the study of the propagation of cracks in materials. It uses methods of analytical solid ... more
A fracture is the separation of an object or material into two, or more, pieces under the action of stress.There are three ways of applying a force to ... more
A fracture is the separation of an object or material into two, or more, pieces under the action of stress.There are three ways of applying a force to ... more
RESTRICTIONS : σ₁ = σ₂ = σ₃ = 0, σ₃₁ = σ₂₃ = 0
The von Mises yield criterion suggests that the yielding of materials ... more
Young’s modulus, also known as the Tensile modulus or elastic modulus, is a measure of the stiffness of an elastic isotropic material and is a ... more
RESTRICTIONS : σ₃ = 0, σ₁₂ = σ₁₃ = σ₂₃ = 0
The von Mises yield criterion suggests that the yielding of materials begins ... more
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