Search results
Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more
Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more
A fracture is the separation of an object or material into two, or more, pieces under the action of stress.There are three ways of applying a force to ... more
A fracture is the separation of an object or material into two, or more, pieces under the action of stress.There are three ways of applying a force to ... more
Fracture mechanics is the field of mechanics concerned with the study of the propagation of cracks in materials. It uses methods of analytical solid ... more
Fracture mechanics is the field of mechanics concerned with the study of the propagation of cracks in materials. It uses methods of analytical solid ... more
Column or pillar in architecture and structural engineering is a structural element that transmits, through compression, the weight of the structure above ... more
Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more
Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more
ontact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more
...can't find what you're looking for?
Create a new formula