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Maximum contact pressure between a rigid cylinder and an elastic half-space

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Force aplied at a contact area between a sphere and an elastic half-space

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Cantilever Euler Beam - Maximum Displacement

Euler–Bernoulli beam theory (also known as engineer’s beam theory or classical beam theory) is a simplification of the linear theory of elasticity ... more

Radius of a Contact Area between two spheres related to the force

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Properties of concrete - modulus of elasticity (AASHTO)

The modulus of elasticity of concrete is a function of the modulus of elasticity of the aggregates and the cement matrix and their relative proportions. ... more

Elastic potential energy( with respect to Length)

Elastic energy is the potential mechanical energy stored in the configuration of a material or physical system as work is performed to distort its volume ... more

Force on a Contact Area between two cylinders with parallel axes

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Cantilever Euler Beam - Displacement

Euler–Bernoulli beam theory (also known as engineer’s beam theory or classical beam theory) is a simplification of the linear theory of elasticity ... more

Total force on a contact area between a rigid conical indenter and an elastic half-space related to the contact radius

Contact mechanics is the study of the deformation of solids that touch each other at one or more points. Hertzian contact stress refers to the localized ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

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