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Elastic deflection at any point along the span of a uniformly loaded cantilevered beam

In engineering, deflection is the degree to which a structural element is displaced under a load. The deflection at any point along the span of a uniformly ... more

Elastic deflection to an end loaded cantilever beam

In engineering, deflection is the degree to which a structural element is displaced under a load.
The elastic deflection of a weightless cantilever ... more

Elastic deflection of a center loaded beam supported by two simple supports.

In engineering, deflection is the degree to which a structural element is displaced under a load.
The elastic deflection of a beam, loaded at its ... more

Elastic deflection to any point along the span of an end loaded cantilever beam

In engineering, deflection is the degree to which a structural element is displaced under a load. The deflection at any point along the span of an end ... more

Elastic deflection at any point along the span of a center loaded beam

Elastic deflection is the degree to which a structural element is displaced under a load.
The deflection at any point, along the span of a center ... more

Maximum elastic deflection of an off-center loaded beam supported by two simple supports

In engineering, deflection is the degree to which a structural element is displaced under a load.
The maximum elastic deflection on a beam supported ... more

Tuning fork (cylindrical prongs)

A tuning fork is an acoustic resonator in the form of a two-pronged fork with the prongs (tines) formed from a U-shaped bar of elastic metal (usually ... more

Beam shear

Shear stress,is defined as the component of stress coplanar with a material cross section. The average shear stress is force per unit area. Beam shear is ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

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