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The wafer bond characterization is based on different methods and tests. Wafer bonds are commonly characterized by three important encapsulation ... more
In physics and applied mathematics, the mass moment of inertia, usually denoted by I, measures the extent to which an object resists rotational ... more
In physics and applied mathematics, the mass moment of inertia, usually denoted by I, measures the extent to which an object resists rotational ... more
In physics and applied mathematics, the mass moment of inertia, usually denoted by I, measures the extent to which an object resists rotational ... more
The cross section is an effective area that quantifies the intrinsic likelihood of a scattering event when an incident beam strikes a target object, made ... more
The Sagnac effect, also called Sagnac interference, named after French physicist Georges Sagnac, is a phenomenon encountered in interferometry that is ... more
Converging lens in air will focus a collimated beam travelling along the lens axis to a spot (known as the focal point) at a distance “f” from ... more
Bending is a manufacturing process that produces a V-shape, U-shape, or channel shape along a straight axis in ductile materials, most commonly sheet ... more
Bending is a manufacturing process that produces a V-shape, U-shape, or channel shape along a straight axis in ductile materials, most commonly sheet ... more
A lens is a transmissive optical device which affects the focusing of a light beam through refraction. A simple lens consists of a single piece of ... more
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