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Maximum elastic deflection of an off-center loaded beam supported by two simple supports

In engineering, deflection is the degree to which a structural element is displaced under a load.
The maximum elastic deflection on a beam supported ... more

Maximum value of bending moments for a center loaded beam supported by two simple supports

A bending moment is the reaction induced in a structural element when an external force or moment is applied to the element causing the element to bend. ... more

Angle of deflection of an end loaded cantilever beam

In engineering, deflection is the degree to which a structural element is displaced under a load. It may refer to an angle or a distance.
The angle of ... more

Moment of Inertia - I-Beam (Ideal cross section)

An I-beam, also known as H-beam, W-beam (for “wide flange”), Universal Beam (UB), Rolled Steel Joist (RSJ), or ... more

Angle of deflection of a uniformly loaded cantilever beam

In engineering, deflection is the degree to which a structural element is displaced under a load. It may refer to an angle or a distance.
The angle of ... more

Maszara model DCB test (The compliance of a symmetric DCB speciment)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more

Maximum deflection distance of an off-center loaded beam supported by two simple supports

In engineering, deflection is the degree to which a structural element is displaced under a load.
This maximum deflection occurs at a distance x_1 ... more

Cantilever Euler Beam - Maximum Displacement

Euler–Bernoulli beam theory (also known as engineer’s beam theory or classical beam theory) is a simplification of the linear theory of elasticity ... more

Auger electron spectroscopy - electron impact cross-section

Auger electron spectroscopy is a common analytical technique used specifically in the study of surfaces and, more generally, in the area of materials ... more

Maszara model DCB test (surface fracture energy)

Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced ... more

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