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Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. ... more
Effusion is the process in which a gas escapes through a small hole. This occurs if the diameter of the hole is considerably smaller than the mean free ... more
Thermal energy is a term sometimes used to refer to the internal energy present in a system in a state of thermodynamic equilibrium by virtue of its ... more
Due to leakage of fluid between the back surface of the impeller hub plate and the casing, or through other pump components – there is a volumetric ... more
In optics, the f-number (sometimes called focal ratio, f-ratio, f-stop, or relative aperture) of an optical system is the ratio of the lens’s focal ... more
Geodetic latitude is the angle between the normal and the equatorial plane. The distance from the Earth’s center to a point on the spheroid surface ... more
In a sufficiently narrow tube of circular cross-section of radius “a”, the interface between two fluids forms a meniscus that is a portion of the surface ... more
Auger electron spectroscopy is a common analytical technique used specifically in the study of surfaces and, more generally, in the area of materials ... more
n mathematics, and more specifically in algebraic topology and polyhedral combinatorics, the Euler characteristic (or Euler–Poincaré characteristic) is a ... more
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